- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
Patent holdings for IPC class H01L 21/768
Total number of patents in this class: 24004
10-year publication summary
2140
|
2219
|
2371
|
2536
|
2613
|
2725
|
2396
|
2312
|
2139
|
633
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
5208 |
International Business Machines Corporation | 60644 |
1328 |
Samsung Electronics Co., Ltd. | 131630 |
1230 |
Intel Corporation | 45621 |
919 |
Applied Materials, Inc. | 16587 |
850 |
Micron Technology, Inc. | 24960 |
804 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
640 |
Tokyo Electron Limited | 11599 |
625 |
United Microelectronics Corp. | 3921 |
406 |
SK Hynix Inc. | 11030 |
388 |
Changxin Memory Technologies, Inc. | 4732 |
379 |
Kioxia Corporation | 9847 |
370 |
Nanya Technology Corporation | 2000 |
350 |
Sandisk Technologies LLC | 5684 |
329 |
Sony Semiconductor Solutions Corporation | 8770 |
309 |
Lam Research Corporation | 4775 |
303 |
Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
267 |
Qualcomm Incorporated | 76576 |
214 |
Yangtze Memory Technologies Co., Ltd. | 1940 |
211 |
Infineon Technologies AG | 8189 |
204 |
Other owners | 8670 |